Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao种类:
年:
2019
出版社:
Woodhead Publishing
语言:
english
页:
434
ISBN 10:
0081025327
ISBN 13:
9780081025321
系列:
Woodhead Publishing Series in Electronic and Optical Materials Ser
文件:
PDF, 18.78 MB
IPFS:
,
english, 2019