募捐 9月15日2024 – 10月1日2024 关于筹款

Multichip Modules: Systems Advantages, Major Constructions,...

Main
Engineering
Multichip Modules: Systems Advantages,...

Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies

Johnson R.W., Teng R.K.F., Balde J.

0 / 0

你有多喜欢这本书？

下载文件的质量如何？

下载该书，以评价其质量

下载文件的质量如何？

种类:

年:

1991

出版社:

Ieee

语言:

english

页:

598

ISBN 10:

087942267X

ISBN 13:

9780879422677

文件:

DJVU, 12.87 MB

IPFS:

,

english, 1991

线上阅读

正在转换

转换为失败

您可能会感兴趣

— COMPREHENSION SKILLS SERIES CB-4

Ball Grid Arrays.pdf — Ball Grid Arrays.pdf

Kevin D. Cluff, Michael G. Pecht — Chapter 10A1 - Electronic Packaging Technologies

Unknown — "Circuit Analysis Computing of Semiconductor Packages and Systems". In: Wiley Encyclopedia of Electrical and Electronics Engineering

Ulrich R.K., Brown W.D. (Ed.) — Advanced Electronic Packaging

2014 — Microwave and millimeter-wave electronic packaging

John H. Lau — Flip Chip Technologies

Rao R. Tummala — Fundamentals of Microsystems Packaging

Norman G Einspruch — VLSI electronics : microstructure science, volume 5

C. P. Wong (Eds.) — Polymers for Electronic & Photonic Application

H. B. Bakoglu — Circuits, Interconnections, and Packaging for Vlsi

Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council — Materials for High-Density Electronic Packaging and Interconnection

— Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

Tapan K. Gupta(auth.) — Handbook of Thick- and Thin-Film Hybrid Microelectronics

John G. Webster (Editor) — 11.Components, Packaging, and Manufacturing Technology

Robert J. Hannermann, Allan D. Kraus, Michael Pecht — Physical Architecture of Vlsi Systems

Stuart K. Tewksbury — Microelectronic System Interconnections: Performance and Modeling/Pc0300-4

Puligandla Viswanadham, Dereje Agonafer — Essentials of electronic packaging: a multidisciplinary approach

Fred D. Barlow III, Aicha Elshabini — Ceramic Interconnect Technology Handbook

Happy Holden — The HDI Handbook

Keser, Beth; Kroehnert, Steffen — Advances in embedded and fan-out wafer level packaging technologies

Katsuyuki Sakuma — 3D Integration in VLSI Circuits: Implementation Technologies and Applications

Yufeng Jin; Zhiping Wang; Jing Chen — Introduction to microsystem packaging technology

Antonis Papanikolaou, Dimitrios Soudris (auth.), Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic (eds.) — Three Dimensional System Integration: IC Stacking Process and Design

Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.) — RF and Microwave Microelectronics Packaging

William Greig — Integrated Circuit Packaging, Assembly and Interconnections

Andrew E Fletcher (Auth.) — Advanced Organics for Electronic Substrates and Packages

George R. Dallimore (auth.), Lawrence L. Rosine (eds.) — Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2

Muhannad S. Bakir, James D. Meindl — Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Sturdivant, Rick — Microwave and millimeter-wave electronic packaging

Kenneth A. Jackson, Wolfgang Schroter — Handbook of Semiconductor Technology, Volume 2

Suny Li (editor) — MicroSystem Based on SiP Technology

John H. Lau — Chiplet Design and Heterogeneous Integration Packaging

John H. Lau — Chiplet Design and Heterogeneous Integration Packaging

Chuan Seng Tan; Kuan-Neng Chen; Steven J. Koester (eds.) — 3D Integration for VLSI Systems

关键词